On Thursday, multinational semiconductor manufacturer TSMC announced updated roadmaps for its 3nm and 2nm chip process technologies at the 2023 North American Technology Symposium. The 3nm series includes four versions: the basic N3, the cost-optimized N3E, the performance-enhanced N3P, and the high-voltage tolerant N3X. TSMC claims that compared to the 3nm chip technology (N3 series), the speed of the 2nm chip will increase by 15% using the same power consumption, and that power consumption will be reduced by 30% when used at the same speed. The company plans to start mass production of the advanced 2nm chip in 2025, while the N3 series is expected to debut between the second half of 2023 and early 2025. The N3E will be released in the second half of 2023, while the N3P and N3X are set to debut in the second half of 2024 and 2025, respectively. [IThome, in Chinese]
